According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrication techniques that provide precise ...