According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of ...