Volume Reflects Cost, Yield and Reliability Advantages of eWLB Technology and Company’s Success at Introducing it into New Markets PORTO, Portugal--(BUSINESS WIRE)-- NANIUM, a global leader in 300mm ...

VILA DO CONDE, PORTUGAL--(Marketwired - Oct 29, 2013) - NANIUM S.A., Europe's largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an ...

SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging ...

System-in-Package (SiP) technology continues to be essential for higher integration of functional blocks to meet the ever demanding market needs with respect to smaller form factor, lower cost and ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/83cm7r/infineon_rrn7745p) has announced the addition of the "Infineon ...

Rudolph Technologies announced that it has received multipleorders for its NSX and WaferScanner inspection systems from STATS ChipPAC. Thesemiconductor test and packaging service provider will use the ...

STATS ChipPAC Ltd will provide manufacturing services to Infineon Technologies AG for the company’s first-generation embedded Wafer-Level Ball Grid Array (eWLB) technology. STATS ChipPAC, a ...

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones sold in China, ...

PORTUGAL, EUROPE: Nanium S.A., Europe's largest OSAT service provider, announced the introduction of an improved dielectric material and process solution for FOWLP technology, eWLB. These improvements ...

A look at design considerations for a double-sided RDL, including board-level reliability and the challenges of higher density. System-in-Package (SiP) technology continues to be essential for higher ...