EDN

New Power Semicondutor Package

This application note presents the combinations of the features of modules and discrete in a new power semiconductor package. The document describes the packaging technology, the topologies and ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Yahoo Finance

Advanced Semiconductor Packaging Report 2024-2035, Featuring Review of Drivers Drivers ML/AI, Data Centers & EV/ADAS & Emerging Approaches of System-In-Package, Monolithic 3D ...

Dublin, Jan. 29, 2024 (GLOBE NEWSWIRE) -- The "Global Market for Advanced Semiconductor Packaging 2024-2035" report has been added to ResearchAndMarkets.com's offering. The global landscape of ...
Business Wire

Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...