This figure depicts the synthesis of metallic 1D mirror twin boundaries through Van der Waals epitaxial growth (top) and the large-area 2D semiconductor integrated circuit constructed based on these ...

"If you watch the evolution of the DRAM and foundry (contract chip manufacturing) and packaging processes, you can see that technologies with the same character are being integrated. For semiconductor ...

SEMI, the leading international semiconductor trade organization held its Semicon conference in San Francisco in July. SEMI predicts significant growth in semiconductor equipment demand in 2022 and ...

WALTHAM, Mass., October 28, 2025--(BUSINESS WIRE)--From smartphones to autonomous cars to AI supercomputers, nearly every electronic innovation we use today depends on complicated structures at the ...

Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former stating that it ...

Phoenix – Three 3.3/5-volt logic devices from ON Semiconductor can operate at up to 3 GHz and are optimized to support OC-48 line-speed requirements. The MC10/100EP142, a 9-bit linear shift register; ...

Logic semiconductor manufacturers plan to replace FinFET devices with Gate All Around at sub-3nm nodes. Applied Materials has introduced a complex seven chamber system with Atomic Layer Deposition as ...

A team of scientists from the Institute for Basic Science has developed a revolutionary technique for producing 1D metallic materials with a width of less than 1 nm by epitaxial growth. Using this ...

Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these ...

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation ...