Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Compared to leaf-spring terminals, the LSF-SMT push-in, direct-connect PCB terminals promise to reduce wiring time by up to 50%. Requiring no tools, the terminals provide safe and reliable connections ...
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