The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point ...

Memory systems have evolved a lot in the previous few years due to advancements in fabrication technology. High Bandwidth Memory (HBM) is an example of the latest kind of memory chips which can ...

SUNNYVALE, Calif., May 21, 2008 – Denali Software, Inc., today, as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update ...

In September, Rambus announced the achievement of reaching 4 gigabits per second (Gbps) operation with our HBM2E memory interface. This milestone was demonstrated in silicon and required mastering ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Continuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced sampling 1 of the industry’s first 2 Universal Flash Storage (UFS) 3 ...

TL;DR: Synopsys has successfully completed silicon bring-up of its LPDDR6 IP on TSMC's advanced N2P process, delivering up to 86GB/sec bandwidth and significant generational upgrades over LPDDR5. This ...

Cadence Design Systems, Inc. CDNS recently launched the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution, designed on the advanced TSMC N3 process node. This leading-edge memory ...

High-speed-digital serial I/O links and DDR memory interfaces are presenting significant measurement challenges as fourth-generation standards emerge. As signals travel at ever higher speeds over ...

Why it matters: The JEDEC Solid State Technology Association has introduced a new Crossover Flash Memory (XFM) specification for NAND storage, designed to replace the existing M.2 form factor. Its ...