TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

Diodes Incorporated (www.diodes.com) has introduced a six-member SBR family of 3A and 2A rectifiers in PowerDI123 flat lead frame packages. Diodes Inc. has introduced a six-member SBR family of 3 A ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...