ISSCC addressed challenges for electronics to meet AI demand, AI to speed up the design and training the next generation workforce on chip design.

The chip market is facing a wave of price increases, with companies issuing hike notices and foundries preparing to raise prices for the 8-inch wafer process amid current supply-demand dynamics. Many ...

Explore how Sandra Shaji, a Samsung engineering leader, is pioneering DTCO infrastructure for sub-2nm semiconductor design.

More and more powerful AI chips are needed for increasingly complex AI applications. Aiming to boost Germany’s innovative strength in this cutting-edge technology in Heilbronn, the Fraunhofer ...

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

Siemens (XTRA:SIE) has launched the Questa One Agentic Toolkit, adding agentic AI workflows to its integrated circuit design verification software. The company has also signed a partnership with Rock ...

Collectively, the startup’s founding team has 10 decades of experience in chip design, AI applications and product development at Texas Instruments, Qualcomm and other global companies, alongside 70 ...

For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...

Discover more & book a meeting via: SEALSQ Corp (NASDAQ: LAES) (“SEALSQ” or the “Company”), a leader in semiconductors, ...

As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.