GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Virtual prototypes are essential to optimize the signal integrity performance of their high-performance electronics products. Today, engineering teams are pushing to get fast electromagnetic (EM) ...

Ansoft has released version 11 of its flagship product, HFSS, with new technology said to deliver greater accuracy, capacity and performance. New higher-order hierarchical basis functions and an ...

PITTSBURGH, PA, March 26, 2021 – Global Unichip Corporation (GUC) is adopting a groundbreaking simulation workflow developed by Ansys (NASDAQ: ANSS) to accelerate Advanced-IC design. The workflow ...