Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

The company received additional orders in 3Di metrology, including from an OEM for panel level process development, and sees growth in panel-level packaging as a trend for enterprise server and AI ...

FICG cordially invites industry professionals to visit Booth A521 at APE 2026 to discuss high-speed optical transceiver process integration, advanced packaging, and volume production support solutions ...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...