SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first ...
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The company filed all relevant patent stuff with the United States Patent Application Publication on April 6, 2023, for what it's calling a 3D NAND-like DRAM cell array structure for memory. This new ...
For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...
Next-gen memory designed as a lower-cost, lower-power HBM alternative for AI workloads ...
NAND flash technology is on a roll with advancements in cell structure and the subsequent boost in storage density. That allows this non-volatile-memory (NVM) chip to deliver faster throughput and ...
A virtual DOE-based process sensitivity check was performed for two tiers of channel holes in a 3D NAND device. The channel hole tilt distance, twist angle, and their sensitivities to the visible area ...
Samsung has announced a new type of V-NAND, with three bits per cell and 48 layers per chip. The company wants to make terabyte-class SSDs much more popular than they currently are, in both data ...
Sandisk is on track to double the price of its high-capacity 3D NAND memory devices for enterprise-grade solid-state drives this quarter in anticipation of strong demand for server-class storage in ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...