Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

Chipmakers have stepped up development of their respective 120/128-layer 3D NAND flash process technologies for cost competitiveness, and are gearing up to have the technology transitions kick off in ...

Chipmakers are aggressively improving their new 96-layer 3D NAND process yield rates, looking to have the technology become the mainstream in 2020, according to industry sources. Save my User ID and ...

It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...

Silicon has been with us for many decades but will need a replacement. For NAND storage, it has become increasingly difficult to progress by shrinking the process. The chief way to combat this is to ...

The NAND flash business is transitioning from the process that has been used for the past 20-odd years (let's call it "2D") and the new process that promises to carry the technology through the end of ...

Silicon nitride (Si3N4) etching is a critical process step in the fabrication of three-dimensional NAND flash memories, where vertically stacked layers demand exceptional process precision. The ...

If you haven’t heard of BeSang Inc, it is the company that invented and licenses 3D monolithic chip technology to SK hynix. According to a report published by the EE Times, BeSang has become ...

Rising Demand for High-Capacity Storage Solutions: The 3D NAND Flash Memory Market is growing due to the increasing demand for large storage capacity in consumer devices, data centers, and corporate ...

SK hynix on Monday said it had commenced mass production of its 321-layer, 2Tb 3D QLC NAND memory devices that promise to enable ultra-high-capacity SSDs — up to 244TB and beyond — for data center use ...